Product Description
Electroplating Grade Copper Sulphate is a high-quality, water-soluble compound designed for industrial applications. Presented in powder form, this chemical features the molecular formula CuSO4 and ensures precise performance in electroplating processes. With a melting point of 110C and a density of 3.6 g/cm, it offers excellent stability and reliability for various industrial uses. Stored at room temperature, it retains its efficacy throughout its shelf life of 1 year. The grade specificity emphasizes its suitability for producing smooth and uniform coatings in electroplating tasks, ensuring superior conductivity and surface finish. Its solubility in water makes it easy to prepare solutions for immediate use in industrial settings. Perfect for manufacturers, traders, and suppliers, this product guarantees consistency and optimal results in demanding environments.
FAQs of Electroplating Grade Copper Sulphate:
Q: What is the physical form of Electroplating Grade Copper Sulphate?
A: Electroplating Grade Copper Sulphate is available in powder form.
Q: Is this product water-soluble and suitable for solution preparation?
A: Yes, this product is water-soluble and ideal for preparing solutions for electroplating applications.
Q: What is the shelf life of Electroplating Grade Copper Sulphate?
A: The shelf life of this product is 1 year when stored at room temperature.
Q: What is the density of this compound?
A: The density of Electroplating Grade Copper Sulphate is 3.6 g/cm.
Q: What is the melting point of Electroplating Grade Copper Sulphate?
A: The melting point of this product is 110C.
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